JPH024999B2 - - Google Patents

Info

Publication number
JPH024999B2
JPH024999B2 JP55152527A JP15252780A JPH024999B2 JP H024999 B2 JPH024999 B2 JP H024999B2 JP 55152527 A JP55152527 A JP 55152527A JP 15252780 A JP15252780 A JP 15252780A JP H024999 B2 JPH024999 B2 JP H024999B2
Authority
JP
Japan
Prior art keywords
thin film
film electrode
lead wire
electrode
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP55152527A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5776775A (en
Inventor
Yoshimitsu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP15252780A priority Critical patent/JPS5776775A/ja
Publication of JPS5776775A publication Critical patent/JPS5776775A/ja
Publication of JPH024999B2 publication Critical patent/JPH024999B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP15252780A 1980-10-30 1980-10-30 Method of soldering lead wire Granted JPS5776775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15252780A JPS5776775A (en) 1980-10-30 1980-10-30 Method of soldering lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15252780A JPS5776775A (en) 1980-10-30 1980-10-30 Method of soldering lead wire

Publications (2)

Publication Number Publication Date
JPS5776775A JPS5776775A (en) 1982-05-13
JPH024999B2 true JPH024999B2 (en]) 1990-01-31

Family

ID=15542378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15252780A Granted JPS5776775A (en) 1980-10-30 1980-10-30 Method of soldering lead wire

Country Status (1)

Country Link
JP (1) JPS5776775A (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596569A (ja) * 1982-07-05 1984-01-13 Nec Corp 混成集積回路の製造方法
JPS59144194A (ja) * 1983-02-07 1984-08-18 株式会社日立製作所 セラミツクス基板の半田付け用端子
JP2648385B2 (ja) * 1990-07-05 1997-08-27 三菱電機株式会社 半導体装置の製造方法
JP2543446B2 (ja) * 1991-02-26 1996-10-16 正一 大谷 自転車
JP5135679B2 (ja) * 2005-11-30 2013-02-06 株式会社村田製作所 積層型圧電素子の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536882A (en) * 1976-07-09 1978-01-21 Hitachi Ltd Thick circuit substrate
JPS5313247U (en]) * 1976-07-16 1978-02-03

Also Published As

Publication number Publication date
JPS5776775A (en) 1982-05-13

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